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Chip packages

BGA

Ball Grid Array
Chip with solder balls on the underside in a grid. Used for high-pin-count parts.

How it looks

Drawing: there is no BGA on CORE3588
from aboveunderneath: a grid of ballsside
A BGA chip. The RK3588 processor is one; it lives on the module that plugs into CORE3588, not on CORE3588 itself.
Real image: CORE3588, the module connector (the BGA is on the module)
125 mm
CORE3588 top side: where the BGA lives instead, on a module plugged in above this area.

How it works

from above: a plain squareunderneath: hundreds of solder balls in a gridplaced on a matching grid of padsreflow: every ball melts at oncejoints are hidden: checked by X-rayinner balls need vias between them to get out

Where it fits

A step beyond QFN. Processors (SoC) usually come as BGAs, which is why boards like CORE3588 buy them pre-mounted on a SoM and plug it in. A flat finish such as ENIG helps.

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