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Validation & fab

Reflow

The oven step that melts solder paste and bonds SMD parts to the PCB.

How it looks

Drawing: a process that happens at the assembler
temperaturetime: about 5 to 8 minutes in allsolder melts (about 217 C)preheatsoakreflowcoolreflowpeak, about 240 to 250 C
A typical lead-free reflow profile: the board rides a conveyor through oven zones and its temperature follows this curve.

How it works

temperaturetime: about 5 to 8 minutes in allsolder melts (about 217 C)preheatsoakreflowcoolpreheatsoakreflowcool

Where it fits

Comes right after pick-and-place; paste was printed through a stencil. Small batches can use a hot plate instead of an oven. Hidden joints like a BGA's are made here and cannot be touched up later.

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